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Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp

Phoenix (suzhou) electronic Co.,ltd
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    Buy cheap Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp from wholesalers
     
    Buy cheap Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp from wholesalers
    • Buy cheap Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp from wholesalers
    • Buy cheap Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp from wholesalers
    • Buy cheap Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp from wholesalers
    • Buy cheap Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp from wholesalers

    Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp

    Ask Lasest Price
    Brand Name : PHOENIX
    Model Number : 2835
    Certification : LM80 CE ROHS
    Price : Negotiation
    Payment Terms : Western Union, MoneyGram, T/T
    Supply Ability : 800KK PER MONTH
    Delivery Time : 7-10 DAYS
    • Product Details
    • Company Profile

    Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp


    Application Introduction:


    The environmental protection benefit is better. There is no ultraviolet and infrared rays in the spectrum, neither heat nor radiation, small glare, recyclable waste, no pollution, no mercury, cold light source, safe to touch, which is a typical green lighting source.


    2835 54V 20MA High voltage SMD LED CHIP for bulb lamp


    Quick details:


    Input Voltage(V):54V
    Warranty(Year):2-Year
    Type:Smd Led Chip 2835
    Lighting solutions service:Lighting and circuitry design
    Luminous Efficacy(lm/w):160lm/w
    Lifespan (hours):50000
    Working Time (hours):20000
    Chip Material:INGAN
    Emitting Color:3000K 4000K 6500K
    Power:1W
    Viewing Angle(°):120 Degree
    Color Rendering Index(Ra):80
    Packing bag:220*240nm
    Place of Origin:Suzhou ,jiangsu
    Application:LED STRIP
    Package Type:Suface Mount Package
    Forward Current:20MA
    Size:2.8*3.5*0.65mm
    Packing:4000 Pcs/Roll


    Product specification:

    Package Structure

    Absolute Maximum Ratings


    ItemSymbolMaximumUnit
    Power dissipationPD1W
    Continuous forward currentIFmax20mA
    Peak forward current (1/10 duty cycle 10ms pulse width)IFP30mA
    Reverse voltageVR5V
    Electrostatic Discharge (HBM)ESD2000V
    Operating temperature rangeTopr-40 to +85
    Storage temperature rangeTstg-40 to +85
    Led yunction temperatureTj125

    Optical/Electrical Characterization:


    ItemSymbolConditionMinTypMaxUnit
    Forward voltageVFIF=60mA505254V
    CIEX,Y

    IF=60mA

    IF=60mA

    -X=0.32-
    -Y=0.34-
    CCTIF=60mA270040006550K
    Viewing Angle2θ1/2IF=60mA-120-Deg
    Luminous IntensityIVIF=60mA120160LM
    CRIRAIF=60mA80RA
    Reverse CurrentIrVr=5V01uA
    Thermal resistanceRth(j-s)IF=60mA28℃/W

    Typical Electro-Optical characteristics curves:

    LED Reliability Test List


    No.ItemTest Conditions

    Test

    hr/cycle/time

    Sample

    Q’ty

    Ac∕Re
    1Solder HeatTEMP:260℃±5℃;5±1 sec2 times30 pcs0∕1
    2Solder ability Test ※TEMP:235℃±5℃;3±1 sec1 time5 pcs0∕1
    3Temperature Cycle

    H:+100℃ 30min.

    ∫5min.

    L:-40℃ 30min.

    100 cycles20 pcs0∕1
    4Thermal Shock

    H:+100℃ 5min.

    L:-40℃ 5min.

    50 cycles20 pcs0∕1
    5High Temperature StorageTEMP:100℃1000 hrs20 pcs0∕1
    6Low Temperature StorageTEMP:-40℃1000 hrs20 pcs0∕1
    7DC Operating LifeIF=IFmax1000 hrs20 pcs0∕1
    8

    High Temperature

    High Humidity

    85℃∕85%R.H.1000 hrs20 pcs0∕1
    9Shocking test

    100~2000Hz ;98.1m/s2

    X,Y,Z direction

    2 hrs20 pcs0∕1
    10Dropping testPut on pallet ;height:75cm3 times20 pcs0∕1
    Judgment Criteria
    Forward Voltage VFVF Max-Increase < 1.1x
    Reverse Current IRIR Max-Increase < IRmax
    Luminous Intensity IVIV Decay < 40%

    ※Solder ability test criteria:coverage is not less than 95%

    Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)


    Packaging:

    Cautions:

    The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the

    Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.


    Soldering iron :
    When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
    The hand solder should be done only one times

    SMT Reflow Soldering Instructions SMT :
    Reflow soldering should not be done more than two times
    When soldering , do not put stress on the LEDs during heating
    The recommended reflow soldering profile as following

    Handling Precautions :
    Handle the component along the side surface by using forceps or appropriate tools
    Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry
    Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry


    Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb LampMicro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb LampMicro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb LampMicro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp


    Product features:


    Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation

    High brightness ,low attenuation high color rendering

    Minimum 70,80,90 95 CRI options

    Strong welding and good stability undead light

    Product series and company logo on the front

    CE ROHS LM80 Certification


    Production Process:


    Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp


    Quality Micro SMD 1 Watt Led Chip 2835 54V 20MA For Bulb Lamp for sale
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